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IR 10 mA Diode Reverse Voltage VR 50 V Lead solder Temperature TS 280 ℃ Lead solder Duration ST 10 S Fiber Bend Radius R 30 MM ※Exceed maximum ratings may cause device damage. Optical and Electr...
IR 10 mA Diode Reverse Voltage VR 50 V Lead solder Temperature TS 280 ℃ Lead solder Duration ST 10 S Fiber Bend Radius R 30 MM ※Exceed maximum ratings may cause device damage. Optical and Electr...
IR 10 mA Diode Reverse Voltage VR 50 V Lead solder Temperature TS 280 ℃ Lead solder Duration ST 10 S Fiber Bend Radius R 30 MM ※Exceed maximum ratings may cause device damage. Optical and Electr...
IR 10 mA Diode Reverse Voltage VR 15 V Lead solder Temperature TS 280 ℃ Lead solder Duration ST 15 S Fiber Bend Radius R 30 MM ※Exceed maximum ratings may cause device damage. Optical an...
IR 10 mA Diode Reverse Voltage VR 15 V Lead solder Temperature TS 280 ℃ Lead solder Duration ST 15 S Fiber Bend Radius R 30 MM ※Exceed maximum ratings may cause device damage. Optical an...
IRectivity (dB)方向性 50 Maximum Optical Power (mw)最大功率 500 Operating Temperature (℃) 工作温度 -40～85 Storage Temperature (℃) 储存温度 -40～85 Package Dimension (mm) (Φ×L) 封装尺寸 Φ5.5*L34 供货信息 WDM-D xx x xx xx xx x ...
IRectivity (dB) 方向性 50 Maximum Optical Power (mw) 最大功率 500 Operating Temperature (℃)工作温度 -40～85 Storage Temperature (℃) 储存温度 -40～85 BOX Package (mm) ABS封装 100*80*10 140*115*18 LGX Package LGX封装 1U, 2U 19’’ Rack mount Packa...
IRectivity (dB) 方向性 50 Maximum Optical Power (mw) 最大功率 500 Operating Temperature (℃)工作温度 -40～85 Storage Temperature (℃) 储存温度 -40～85 BOX Package (mm) ABS封装 100*80*10 140*115*18 LGX Package LGX封装 1U, 2U 19’’ Rack mount Packa...
Absolute Maximum Ratings Parameter Symbol Min Max Unit Operating temperature Range TOP -20 70 ℃ Storage Temperature Range TST -40 85 ℃ Relative Humidity – Storage RHS 95 % Power Handling 300 mW ...
IR 10 mA Diode Reverse Voltage VR 15 V Lead solder Temperature TS 280 ℃ Lead solder Duration ST 15 S Fiber Bend Radius R 30 MM ※Exceed maximum ratings may cause device damage. Optical an...
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