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Module Dimension(mm) (LxWxH) 100x80x10 100x80x10 100x80x10 120x80x18 120x80x18 130x80x29 Specification产品规格-2 Port Configuration 2x2 2x4 2x8 2x16 ...
Modules (CFP2, CFP4, QSFP28,SFP+,XFP,X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic Modules, subsystems, and systems 4. Serial bus and high-speed backplane d...
Modules (CFP2, CFP4, QSFP28,SFP+,XFP,X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic Modules, subsystems, and systems 4. Serial bus and high-speed backplane d...
Modules (CFP2, CFP4, QSFP28,SFP+,XFP,X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic Modules, subsystems, and systems 4. Serial bus and high-speed backplane d...
Modules (CFP2, CFP4, QSFP28,SFP+,XFP,X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic Modules, subsystems, and systems 4. Serial bus and high-speed backplane d...
Modules (CFP2, CFP4, QSFP28,SFP+,XFP,X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic Modules, subsystems, and systems 4. Serial bus and high-speed backplane d...
Modules (CFP2, CFP4, QSFP28,SFP+,XFP,X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic Modules, subsystems, and systems 4. Serial bus and high-speed backplane d...
Modules (CFP2, CFP4, QSFP28,SFP+,XFP,X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic Modules, subsystems, and systems 4. Serial bus and high-speed backplane d...
Modules (CFP2, CFP4, QSFP28,SFP+,XFP,X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic Modules, subsystems, and systems 4. Serial bus and high-speed backplane d...
Modules (CFP2, CFP4, QSFP28,SFP+,XFP,X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic Modules, subsystems, and systems 4. Serial bus and high-speed backplane d...
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