免费发布信息
Modules (CFP2, CFP4, QSFP28,SFP+,XFP,X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic Modules, subsystems, and systems 4. Serial bus and high-speed backplane d...
Modules (CFP2, CFP4, QSFP28,SFP+,XFP,X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic Modules, subsystems, and systems 4. Serial bus and high-speed backplane d...
Modules (CFP2, CFP4, QSFP28,SFP+,XFP,X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic Modules, subsystems, and systems 4. Serial bus and high-speed backplane d...
Modules (CFP2, CFP4, QSFP28,SFP+,XFP,X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic Modules, subsystems, and systems 4. Serial bus and high-speed backplane d...
Modules (CFP2, CFP4, QSFP28,SFP+,XFP,X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic Modules, subsystems, and systems 4. Serial bus and high-speed backplane d...
Modules (CFP2, CFP4, QSFP28,SFP+,XFP,X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic Modules, subsystems, and systems 4. Serial bus and high-speed backplane d...
Modules (CFP2, CFP4, QSFP28,SFP+,XFP,X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic Modules, subsystems, and systems 4. Serial bus and high-speed backplane d...
Modules (CFP2, CFP4, QSFP28,SFP+,XFP,X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic Modules, subsystems, and systems 4. Serial bus and high-speed backplane d...
Modules (CFP2, CFP4, QSFP28,SFP+,XFP,X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic Modules, subsystems, and systems 4. Serial bus and high-speed backplane d...
产品信息名称：光纤切割刀品牌：住友电工Sumitomo 型号：FC-6S 产品特点 日本住友 FC-6S 高精度光纤切割刀适用于精密切割单芯光纤的工具，此切割刀既适用于 250μm 被覆光纤又适用于 900μm 被覆光纤。切割更精确，不需特别技巧。 ...
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