免费发布信息
XENPAK, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic modules, subsystems, and systems 4. Serial bus and high-speed backplane design; 5. Installation testing and tro...
XENPAK, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic modules, subsystems, and systems 4. Serial bus and high-speed backplane design; 5. Installation testing and tr...
XENPAK, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic modules, subsystems, and systems 4. Serial bus and high-speed backplane design; 5. Installation testing and tr...
XENPAK, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic modules, subsystems, and systems 4. Serial bus and high-speed backplane design; 5. Installation testing and tr...
XENPAK, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic modules, subsystems, and systems 4. Serial bus and high-speed backplane design; 5. Installation testing and tr...
XENPAK, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic modules, subsystems, and systems 4. Serial bus and high-speed backplane design; 5. Installation testing and tro...
XENPAK, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic modules, subsystems, and systems 4. Serial bus and high-speed backplane design; 5. Installation testing and tr...
XENPAK, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic modules, subsystems, and systems 4. Serial bus and high-speed backplane design; 5. Installation testing and tr...
XENPAK, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic modules, subsystems, and systems 4. Serial bus and high-speed backplane design; 5. Installation testing and tr...
IXIA LSM10G1-01 10Gigabit Ethernet 10 Gigabit Ethernet LAN Services Module for SFP+/XFP/10GBASE-T/CX4/XENPAK/X2The Ixia 10 Gigabit Ethernet LAN Service Module (LSM) offers unprecedented scalability, performance, and service testing flexibility. The Ixia 10GE LSM is Ixia's third generation 10 Gigabit Ethe...
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