免费发布信息
X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic modules, subsystems, and systems 4. Serial bus and high-speed backplane design; 5. Installation testing and...
X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic modules, subsystems, and systems 4. Serial bus and high-speed backplane design; 5. Installation testing and...
X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic modules, subsystems, and systems 4. Serial bus and high-speed backplane design; 5. Installation testing and...
X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic modules, subsystems, and systems 4. Serial bus and high-speed backplane design; 5. Installation testing and...
X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic modules, subsystems, and systems 4. Serial bus and high-speed backplane design; 5. Installation testing and...
X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic modules, subsystems, and systems 4. Serial bus and high-speed backplane design; 5. Installation testing and...
X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic modules, subsystems, and systems 4. Serial bus and high-speed backplane design; 5. Installation testing and...
X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic modules, subsystems, and systems 4. Serial bus and high-speed backplane design; 5. Installation testing and...
X200尾纤耐腐蚀PU披覆铠装，两端各1.5m，可定制连接方式熔接、防水型FC/APC接头安装方式机械固定 =========================================== 关于聚华科技 杭州聚华光电科技有限公司是一家从事基于物联网技术进行工程安全监测的高新技术企业。定位于桥梁、隧道、边坡、基坑、地铁、矿山、电力等土木工程领...
X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic modules, subsystems, and systems 4. Serial bus and high-speed backplane design; 5. Installation testing and...
|