免费发布信息
XFP,X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic modules, subsystems, and systems 4. Serial bus and high-speed backplane design; 5. Installation testing...
XFP,X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic modules, subsystems, and systems 4. Serial bus and high-speed backplane design; 5. Installation testing...
XFP,X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic modules, subsystems, and systems 4. Serial bus and high-speed backplane design; 5. Installation testing...
XFP,X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic modules, subsystems, and systems 4. Serial bus and high-speed backplane design; 5. Installation testing...
XFP,X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic modules, subsystems, and systems 4. Serial bus and high-speed backplane design; 5. Installation testing...
XFP,X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic modules, subsystems, and systems 4. Serial bus and high-speed backplane design; 5. Installation testing...
XFP,X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic modules, subsystems, and systems 4. Serial bus and high-speed backplane design; 5. Installation testing...
XFP,X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic modules, subsystems, and systems 4. Serial bus and high-speed backplane design; 5. Installation testing...
XFP,X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic modules, subsystems, and systems 4. Serial bus and high-speed backplane design; 5. Installation testing...
XFP,X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic modules, subsystems, and systems 4. Serial bus and high-speed backplane design; 5. Installation testing...
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