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在封装或主动温度控制之前简化了激光二极管LIV测试* 芯片(CHIP)或棒料(bar) 阶段的激光二极管LIV生产测试的综合解决方案* 可通过编程将扫描（sweep）停在光功率极限上* 针对脉冲与DC测试的高精度源与测量性能的完美结合* 基于同步DSP的测量通道确保了高精度的光强度与电压测量* 脉宽从 500ns～5ms，占空比可达4%的可编程脉冲* 脉冲模...
CHIPset is integrated both to transmitter TX and receiver RX side.Features:· Supports 9.95Gb/s to 11.3Gb/s bit rates· SFP 10G with CDR both at TX and RX side.· IEC 608...
CHIP (size B) mm 1.0~2.0 Customizable Pigtail CHIP (size C) mm 1.0~2.0 Customizable *. All the specifications are based on the devices without connector, and guaranteed over wavele...
BinOptics公司制造单片集成在磷化铟等半导体材料的光电元件。目前的产品包括边缘发光和表面FP发射激光器，DFB激光器，光电二极管等。公司产品优质的性能及价格使其成激光器制造商中的佼佼者。BinOptics产品● 2.5Gbps 1310nm FP/DFB CHIP, TO● 2.5Gbps 1550nm FP/DFB CHIP, TO● 10Gbps, 6Gbps 1310nm FP/DFB TO应用领域：● PON● 1...
芬兰Modulight公司是全球领先的光功率半导体激光器制造商，为您提供从裸芯片到系统的全套激光器解决方案。单模激光二极管（OTDR应用）CHIPs • TO-cans • fiber-coupled modules1310 - 1490 - 1550 - 1625 - 1650 nm...
CHIP、TO封装、IC、藕合、加工组装、销售等六个方面组成，盛华微系统凭借其在光模块行业10多年的行业优势，统一产品工艺标准，承担产品销售服务。 3、在“1*9单芯片数字光模块”产品线的资源整合中，盛华微系统凭借自身在金融系统的良好信誉，帮助我们的客户与银行对接，获得银行资金支持。 ★优势： 兼容性提高50%、稳定性...
WSLS with DFB LD CHIP, wavelength 1310±2nm, output power≥15.00mw, 14-pin butterfly package built-in optical isolator and thermoelectric cooler, 1.00±0.10m polarization-maintaining optical fibre pig...
SLED broadband light source with SLED CHIP, wavelength 1310/1400/1490/1550/1610±10nm, power ≥5mw,14-pin butterfly package built in optical isolator and thermoelectric cooler, 1.0m single-mode pigtail&...
WSLS with DFB LD CHIP, wavelength 1527nm--1610nm , power10mw--20mw, 14-pin butterfly package built-in optical isolator and thermoelectric cooler. Specifications： C-Band Wavelengths List and Code...
WSLS with DFB LD CHIP, wavelength 1550±2nm, output power≥15.00mw, 14-pin butterfly package built-in optical isolator and thermoelectric cooler, 1.00±0.10m polarization-maintaining optical fibre pig...
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