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MAX. Insertion loss @PBdB<1.0IL uniformity @PBdB<0.4PDL@pass banddB<0.25Adjacent CH crosstalk@PBdB>25Non-Adjacent. CH XT@PBdB>30Typical A.O.I(in air)deg8/13.5 or CustomizationPitchum500/750/900/1000/1100/1500, etc.Typical beam parallelismdeg<0.2Edge chipmm<0....
MAX) dB ≤2.0 Insertion loss(typical) dB ≤1.7 Wavelength thermal stability nm/°C ≤0.001 Adjacent channel isolation dB ≥30 No-adjacent channel isolatio...
MAX) dB ≤1.6 Insertion loss(typical) dB ≤1.2 Wavelength thermal stability nm/°C ≤0.001 Adjacent channel isolation dB ≥30 No-adjacent channel isolatio...
MAX) dB ≤2.0 Insertion loss(typical) dB ≤1.5 Wavelength thermal stability nm/°C ≤0.001 Adjacent channel isolation dB ≥30 No-adjacent channel isolatio...
MAX) dB ≤2.9 Insertion loss(typical) dB ≤2.5 Wavelength thermal stability nm/°C ≤0.001 Adjacent channel isolation dB ≥30 No-adjacent channel isolatio...
MAX) dB ≤1.2 Insertion loss(typical) dB ≤0.8 Wavelength thermal stability nm/°C ≤0.002 Adjacent channel isolation dB ≥30 No-adjacent channel isolatio...
MAX) dB ≤1.5 Insertion loss(typical) dB ≤1.2 Wavelength thermal stability nm/°C ≤0.002 Adjacent channel isolation dB ≥30 No-adjacent channel isolatio...
MAX) dB ≤1.8 Insertion loss(typical) dB ≤1.4 Wavelength thermal stability nm/°C ≤0.002 Adjacent channel isolation dB ≥30 Non-adjacent channel Isolati...
MAXimum power handlingmW500Operation temperature℃-40 ~ +85Operation humidity%RH5 to 90%RH not condensedStorage temperature℃-40 ~ +85Storage humidity%RH0 to 95%RH not condensedTensile strengthN>5...
MAXimum power handlingmw500Operation temperature℃-40 ~ +85Operation humidity%RH5 to 90%RH Not condensedStorage temperature℃-40 ~ +85Storage humidity%RH0 to 95%RH Not condensedTensile strengthN>5...
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