富光科技 CWDM 4 Rx TFF 一体化集成光组件基于 Fiber-to-the-Chip (FTTC) on-board connectivity technolog从光纤到芯片的板上连接技术,应用于400G及更高速率光模块的接收端,起分波作用,它由Receptacle链接头、迷你准直器、CWDM 4 Z-block、透镜阵列和输出棱镜等经过高精度pitch定位组装而成。通过对有限空间范围内光路...
单片集成 6 比特光延时芯片Single-chip integrated 6 Bit Optical Delay Chip〖简介Introduction〗 梓冠光电的单片集成 6 比特光延时芯片是基于厚膜 SOI 硅光子技术、将硅基光开关和硅波导延时路单片集成的自主研发产品。集成的硅基光开关使其延时态切换速度达到 1 μs 以下,硅波导延时使其延时精度提升 1 个量级,厚膜 SOI 硅...
硅基单片集成 9bit 可调光时延线芯片Single-chip integrated 9 Bit Optical Delay Chip〖简介Introduction〗 单片集成多比特光时延芯片基于厚膜 SOI 硅光子技术,是目前综合性能最优和集成度最高的光时延器产品。采用二进制多级时延回路结构,芯片集...
硅基单片集成 9bit 可调光延迟线芯片Silicon-based Single-chip integrated 9Bit VODL Chip〖简介Introduction〗 单片集成多比特光时延芯片基于厚膜 SOI 硅光子技术,是目前综合性能最优和集成度最高的光时延器产品。采用二进制多级时延回路结构,芯片集成时延切换开关和包含了均衡和杂波抑制衰减器的延迟光波导回路...
泵浦合束器+光纤光栅一体化器件Pump Combiner integrated with FBG种类:1. (N+1)X1/NX1 Pump Combiner+High Reflectivity (N+1)X1/NX1 泵浦合束器+光栅HR端 2. Output Coupler+(N+1)X1 Pu...
integrated in one; 7. Computer control via USB 8. Compact Size, Cost effective solution for production 应用范围: 1. Testing of optical transceiver modules (CFP2, CFP4, QSFP28,SFP+,XFP,X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing ...
integrated in one; 7. Computer control via USB 8. Compact Size, Cost effective solution for production 应用范围: 1. Testing of optical transceiver modules (CFP2, CFP4, QSFP28,SFP+,XFP,X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing ...
integrated in one; 7. Computer control via USB 8. Compact Size, Cost effective solution for production 应用范围: 1. Testing of optical transceiver modules (CFP2, CFP4, QSFP28,SFP+,XFP,X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing ...
integrated in one; 7. Computer control via USB 8. Compact Size, Cost effective solution for production 应用范围: 1. Testing of optical transceiver modules (CFP2, CFP4, QSFP28,SFP+,XFP,X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing ...
integrated in one; 7. Computer control via USB 8. Compact Size, Cost effective solution for production 应用范围: 1. Testing of optical transceiver modules (CFP2, CFP4, QSFP28,SFP+,XFP,X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing ...