免费发布信息
X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic modules, subsystems, and systems 4. Serial bus and high-speed backplane design; 5. Installation testing and...
X25（模块）296X260x89（台式）...
X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic modules, subsystems, and systems 4. Serial bus and high-speed backplane design; 5. Installation testing and...
X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic modules, subsystems, and systems 4. Serial bus and high-speed backplane design; 5. Installation testing and...
X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic modules, subsystems, and systems 4. Serial bus and high-speed backplane design; 5. Installation testing and...
X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic modules, subsystems, and systems 4. Serial bus and high-speed backplane design; 5. Installation testing and...
X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic modules, subsystems, and systems 4. Serial bus and high-speed backplane design; 5. Installation testing and...
X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic modules, subsystems, and systems 4. Serial bus and high-speed backplane design; 5. Installation testing and...
X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic modules, subsystems, and systems 4. Serial bus and high-speed backplane design; 5. Installation testing and...
X2, Xenpak, XPAK), transponders, linecards, and subsystems; 2. Testing of opto-electronic components and devices (TOSA, ROSA, lasers, etc.); 3. Testing of Gbps ICs, PCBs, electronic modules, subsystems, and systems 4. Serial bus and high-speed backplane design; 5. Installation testing and...
|